Reflow soldering thermal profiles3/16/2024 Most simply create three or four standard profiles, based mainly on number of layers, and run all their jobs using one of these “close enough” standard settings.īut by measuring, optimizing and recording the unique thermal profile of each board design during pre-production, we achieve lower solder defect rates in manufacturing. Not a lot of high-mix manufacturers do this. Then for each production run, we enter the board’s part number and automatically pull up the settings to optimize soldering for that board. When we get the profile right, we store the settings by board part number in the memory of the solder oven or wave solder machine. If we need to, we change the rate of heating by independently adjusting several different temperature zones in the solder machines. that all areas of the board reached the right temperature and held it for the right amount of time for preheating and reflow, as specified by the solder data sheet.that we didn’t exceed the maximum rate of heating.that no area of the board exceeded the maximum temperature ratings for the components.temperature graphs for different areas of the board. The Datapaq goes through the solder oven with the bare board, recording board temperatures the entire time. Where there will be larger, heavier components, we add an appropriate mass to mimic the local impact on heating. Temperature probes from the Datapaq are attached in several places to the board to be profiled. To do this we use a Datapaq – data acquisition hardware in a heat-shield case. You can optimize solder machine settings to get the profile right for each board. It’s affected by the number of layers: More layers mean more copper and a greater amount of heat absorbed.ĭifferent sections of the same board can have different profiles: Areas like this with lots of copper heat up more slowly than areas like this. Overheating damages components, and insufficient heating gives you bad solder joints.Ī printed circuit board’s thermal profile shows its temperature over time during soldering. You can’t heat it too slowly, or the flux can dry out before a good solder joint forms. ![]() You can’t heat the board too quickly, or you can get splatter and solder balls. Today we’re going to talk about the use of thermal profiling in soldering operations.Īs printed circuit board assemblies go through solder reflow or wave solder, every area of the board has to reach the right temperature for soldering and remain there for the right amount of time.
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